ANDUS Electronic

X-Cool^SMT
High current PCB with a 1 mm copper plane protruding onto the TOP for power MOSFETs

Semiconductor Switch
3 mm thick inlays with direct contact to 10 MOSFETs and shunt resistors (KL30)

ZeroGap
Spezial IMS substrate for power loss densities up to 10 W/mm², esp. for high-power LEDs

Pipeline Valve Drive
High current PCB for up to 400A I_eff with two planes
of 1 mm copper each

1 mm Thick Copper
with isolated potentials for an automotive steering control application

X-Cool^SMT Copper Inlay
Massive copper inlay with protruding pads to TOP and BOT to maximize copper cross sections

Iceberg Technique
250 µm thick copper on outer layers combined with 50 µm thick copper for fine-pitch components

Frame Technique
3 mm copper heatsink with a grid of PCB to deal with electrical and thermal issues separately